What makes an HDI PCB different?

Q: Is every fine-pitch board an HDI PCB?

No. Fine-pitch components may trigger an HDI review, but the board becomes an HDI candidate only when the routing or package escape needs microvias, blind or buried vias, via-in-pad, or build-up stackup choices beyond ordinary multilayer routing.

Q: What should I send before quoting an HDI PCB?

Send the released stackup, drill and layer mapping, microvia and blind or buried via requirements, via fill or cap notes, surface finish, impedance or coupon needs, inspection expectations, quantity, and assembly constraints.

Q: Does HDI automatically improve reliability?

No. HDI can reduce routing distance and board area, but reliability depends on stackup design, microvia structure, plating, material selection, thermal exposure, inspection scope, and whether the supplier can build the requested structure consistently.

Question

What makes an HDI PCB different?

Accepted Answer

An HDI PCB differs from a conventional multilayer board by using microvias, blind or buried vias, via-in-pad, and build-up stackups for dense routing.