Why are AOI and X-ray inspections critical for high-reliability PCBs?

AOI and X-ray inspections detect defects invisible to the naked eye. AOI identifies surface flaws like solder bridges, while X-ray reveals internal issues such as voids or misaligned components, ensuring reliability.

Where do engineers commonly make mistakes in inspection planning?

A common error is using AOI alone for high-density boards, missing internal defects. Another is neglecting X-ray for fine-pitch components, where solder joint integrity is harder to assess visually.

How can you verify inspection effectiveness before production?

Conduct a test run with a sample batch. Validate AOI settings against known defects and perform X-ray checks on critical areas like BGA pads or solder joints.

What information should be included in your RFQ for inspection planning?

Specify stackup details, component types (e.g., BGA, SMT), tolerance levels, and required traceability. Mention if X-ray is mandatory for specific zones.

Omini PCBA

How to Plan AOI and X-Ray Inspection for High-Reliability PCB Assemblies

Plan AOI & X-ray inspection for high-reliability PCB assemblies by matching inspection method to package type, stackup risk, BOM data, and test evidence.